The NSI UV FLEX Dual Beam System is an advance laser processing solution aim for high precision high volumn FPC, LCP, COF production. Aim for high efficiency and optimal routing function, this system is designed for fine feature laser routing. Additional micro-machining capabilities include cutting, depanelling, microvias drilling, scribing and skiving.UV Flex System for Flex PCBs, IC substrates and High Density Interconnect (HDI) PCBs.
Model: UV-FLEX-DB
- Laser Source: 10w-20w UV laser
- NSIconverter TM to generate optimal isolation routing.
- Capable of processing 15/15 line/space fine feature.
- Advance optics design to enable 50/50 Beam Split to double processing throughput.
- Max working area: 20″ x 24″
- Panel compensation (offset, rotation and scaling X/Y versus alignment marks)
CCD camera vision - Option with Roll-to-Roll automation for higher throughput
UV-FLEX-DB Dual Beam system
