The NSI-GWS-170S laser system is designed for PERC cell back scribing process and any number of micromachining processes such as drilling, skiving, and scribing on solar wafer. It is ideal as modular system for any number of mass production lines.
NSI-GWS-Series is modular wafer scribe system with high efficiency.
Model: NSI-GWS-170S
- Laser: 25w green
- Max wafer size: 170mm x170mm
- Table Configuration: Specialized wafer grabbing hand with 90-180 degree rotation for
precision and protection - High Speed Scanning Devices: High-speed galvo scanning at ≥25m/s
- CCD imaging system for precise posting and process quality control.
- Load/Unload Automation: Inline or Stacked Loading/Unloading
GWS-170S Wafer Scribe System
