THANK YOU for visiting our booth and discuss your applications at IPC APEX EXPO during Feb 2-6, 2020. We are very pleased to showcase our latest innovations in fine feature laser processing for laser drilling and circuit patterning. Here is the recap of our new exciting offering!
15 MICRON FINE FEATURE?
CHECK OUR NEWEST MODEL
UV-FLEX-DB
- Advance optics design to enable 12 micron beam size for 15/15 line/space fine feature processing.
- NSIconverter to generate optimal isolation routing.
- 50/50 Beam Split to double processing throughput.
- Optional Roll-to-Roll automation.
- Typical Material: Copper foil, LCP, PI, COF, etc.
Processing Samples
Microvias
15/15 line & spacing
Pattern routing
Cross Section
Contact us
NSI Laser showcase at IPC APEX EXPO 2020