Established in 2012, NSI LASER is an innovative company that specializes in laser micro-machining systems and services. NSI is dedicated to provide laser machines with high precision and efficiency through both prototyping and mass production.
Laser Micro-machining Equipment Design and Manufacturing
International Support
Available through both online and in person, our tech support is not limited by distance
Precise Micromachining
Laser drilling, routing, cutting, depanelling, scribing, skiving etc. all up to 15 microns of precision with our custom routing software
Automation Integration
Utilize automation to help improve your laser system’s efficiency and speed
Our machines
versatile & precise drilling
Our Hybrid UV and CO2 laser system is a versatile laser processing solution ideal for recipe development and experimenting with new materials. This system is suitable for R&D and complex applications that require higher precision and more controlled laser processing capabilities. Our laser micromachining capabilities include via drilling, cutting, routing and skiving.
The combined UV and CO2 laser system are perfect for PCB (printed circuit board) processing. The UV laser is ideally suited for fast and efficient drilling of copper layers whereas the CO2 laser is better suited for the acrylic layer of the PCB. Combined, the UV/CO2 provides a single step setup for drilling through multilayer PCBs.
high throughput multipurpose
The NSI UV FLEX Dual Beam System is an advanced laser processing solution with high precision and volume FPC, LCP, COF production. Possessing high efficiency and optimal routing functions, this system is designed for fine feature laser routing. It comes with NSIconverter™️ software which converts drilling patterns to isolation routes. Additional micro-machining capabilities include cutting, depanelling, microvia drilling, scribing and skiving.
affordable precise driling
NSI UV Drilling Machine is an affordable single laser system made for mass production. The system is suitable for high throughput and high yield applications that require accurate, clean, and high quality through holes and blind vias. Additional micro-machining capabilities include cutting, depanelling, routing, and skiving.
Our UV drilling machine is configurable with different laser options (nano or pico second).
affordable multipurpose
The NSI UV-FLEX-500 series is an affordable laser processing solution best for mass production. The system is suitable for high throughput and high yield applications that require multiple laser processes include via drilling, cutting, depanelling, routing, and skiving.
solar wafer scribing
The NSI-GWS-170S laser system is designed for PERC cell back scribing process and other micromachining processes such as drilling, skiving, and scribing. It can be used as a standalone system or be integrated into an inline mass production line.
Our services
application lab
Equipped with multiple laser systems, our application lab can perform sample tests for different processes in the aerospace, medical, military, solar, and electronics industries. We also provide advanced metrology, including equipment such as 3D profilers and optical microscopes. We also offer a more in depth analyses through cross-sections and SEM analysis at material characterization facilities in Silicon Valley.
job shop
Test out your prototypes and concepts at NSI’s job shop. Our team has years of experience in laser processing in ablation, cutting, and drilling. With our production ready tools, we validate manufacturability and conduct initial production runs to demonstrate the potential of your process for volume production.
calibration & maintenance
Online and/or on-site, our technical team provides worldwide engineering services and system support such as full calibration and maintenance services.
Main Applications
via drilling
NSI LASER is continually developing and adding new hole drilling processes and capabilities. Typically we can drill material that range in thickness from very thin films to several mm’s on a high speed setup that can drill thousands holes quickly and repeatably. Depending on the material and specifications, we will choose the optimized tool to drill the holes.
isolation routing
With NSIconverterTM, we can convert Gerber files into isolation routing files. By optimizing the routing path to become compatible with the laser route, we can achieve higher accuracy and quality. Our machine can process fine line/space as small as 15 micron.
cut and depaneling
Thick PCB depaneling
Our system can implement the depaneling process on various PCB material using UV lasers that meet the demand of high-volume PCB manufacturing. Our system can process PCB with minimal carbonization.
FPC and thin film cutting
Singulation-flex and rigid-flex circuits often requires cutting patterns that allows for more circuits on a single panel, which increases the net usable area. With Our NSIcoverter software, our system can do precise free form cutting by customers’ Gerber files.
hatching & skiving
Our machines can remove material to reveal fiducial marks through both hatching and skiving. Our hatch function can process complex patterns to create prototype PCB and allow you to control the overlap to help develop finer recipes.
scribing
Our machines also have scribing functionality that enables you to mark or label your materials.
Interested?
and find out if we’re the right choice for you